MIT6.774F04

About this film

This course is offered to graduates and focuses on understanding the fundamental principles of the "front-end" processes used in the fabrication of devices for silicon integrated circuits. This includes advanced physical models and practical aspects of major processes, such as oxidation, diffusion, ion implantation, and epitaxy. Other topics covered include: high performance MOS and bipolar devices including ultra-thin gate oxides, implant-damage enhanced diffusion, advanced metrology, and new materials such as Silicon Germanium (SiGe).

Directors & creators

MIT OpenCourseWare

Subjects

fabrication processes;silicon;integrated circuits;monolithic integrated circuits;physical models;bulk crystal growth;thermal oxidation;solid-state diffusion;ion implantation;epitaxial deposition;chemical vapor deposition;physical vapor deposition;refractory metal silicides;plasma and reactive ion etching;rapid thermal processing;process modeling;process simulation;technological limitations;integrated circuit design;integrated circuit fabrication;device operation;sige materials;processing

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